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Main
Features
44 x 44 x 5 mm of Copper Plate
Contrary to heat sinks which use a copper core (copper poured inside
aluminium), for the Copper Silent 2 we use more material over the DIE
where high energy flows (copper plate) and in the external areas where
low energy flows, less material (only 5mm aluminium plate). Thus we
achieve a better efficiency, hence better cooling performance without
increasing the weight.
Tin Connection between Copper and Aluminium
The heat transfer of conventional copper cores onto aluminium is
ensured by thermal compound, which transfers the warmth extremely poorly
compared to metals. In contrast to this we use a super-thin tin film.
This has the advantage of approx. 25-times higher heat conductivity of
tin compared with the thermal compound.
Low Profile
Compared to the Copper Silent the cooling performance was improved,
without increasing the height of the heatsink or violating the height
restriction area defined by AMD. Thus compatibility is guaranteed for
all Socket A mainboards. Thanks to the reversed fan mounting, the
relevant airflow height of 56mm is kept low.
Extremely Quiet
The Second Revision of the Copper Silent 2 allowed for the
ventilationsystem to be reworked. The patented "reversed- hanging"
fan is able to practically eliminate the typical buzzing sound of 80mm
fans.
Fan Mounting
The Fan has been mounted onto 4 Rubber supports to stop vibrations being
transmitted to the heat sink.
Clip
Owing to the screwdriver guidance and the joint both the
installation was simplified significantly as well as the de-installation
and is now even possible under extremely close space conditions in the
PC Case.
Naturally the Copper Silent 2 utilizes all 6 hooks of the socket, which
leads as with our predecessor models to a low socket strain.
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